Enhanced sintered silver for SiC wide bandgap power electronics integrated package module
Clicks: 186
ID: 23285
2019
| Reference Key |
lu2019enhancedjournal
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|---|---|
| Authors | Lu, M. |
| Journal | journal of electronic packaging, transactions of the asme |
| Year | 2019 |
| DOI | 10.1115/1.4042984 |
| URL | |
| Keywords | Keywords not found |
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