Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu Solder
Clicks: 197
ID: 54197
2019
| Reference Key |
hillman2019dissolutionjournal
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|---|---|
| Authors | Hillman, D. |
| Journal | journal of electronic materials |
| Year | 2019 |
| DOI | 10.1007/s11664-019-07316-1 |
| URL | |
| Keywords | Keywords not found |
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