Inductively Coupled Plasma Chemical Vapor Deposition for Silicon-Based Technology Compatible with Low-Temperature (≤220 °C) Flexible Substrates
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ID: 92117
2020
| Reference Key |
yang2020inductivelyphysica
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|---|---|
| Authors | Yang, K. |
| Journal | physica status solidi (a) applications and materials science |
| Year | 2020 |
| DOI | 10.1002/pssa.201900556 |
| URL | |
| Keywords | Keywords not found |
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